MIPS Products

Characterization

MIPS tests and Characterizes MIPS IP cores, either stand-alone test chips or embedded in Systems-On-Chip (SoC), and also to fully characterize MIPS System-On-Chip solutions intended for manufacturing.

Test Portfolio - Main IP Areas

  • USB2.0: PHY / OTG / LPC / LVDS Transceivers;
  • Power Management: DC-DC, Charge pump, LDO's, Battery Chargers and Power-On-Reset;
  • Single Cores: General Purpose ADC's and DAC's;
  • Wireless: Wireless LAN Front-end;
  • Video: Video Analog Front End (AFE), Analog Interface for Flat Panel Displays, HDTV and Video Graphics AFE, Video DAC's;
  • Audio: Stereo Audio ADC's and DAC's, Audio Codec's, Class C amplifiers;
  • BaseBand: Analog BaseBand Front-end
    RF: GPS and Galileo Front-end, TV Tuners.

Test & Characterization Division Primary Activities

Development
  • R&D activities for automatic test platforms;
  • R&D activities for auxiliary equipment needed for automation;
  • Firmware and software tools development for automation;
  • Test evaluation and demo boards design;

Test and Characterization

  • Characterization of Chipidea IP cores;
  • Characterization of SoC including Chipidea IP cores;
  • Design Engineering support;
  • Test setup design and assembly;
  • Test Specification and Test Report release.

Logistics

  • Prototyping and test chip packaging follow-up;
  • Test chip tracking system management;
  • Procurement, purchasing and stock management of components for test setup construction;
  • Maintenance and Calibration Plan for lab equipment;
    Sales, support and Evaluation Board Dispatch management;
  • Documents and manuals organization;
    IP Evolution Board

Lab Facilities

  • 14 racks for equipment mounting, allowing up to 7 test setup bench simultaneous (at TagusPark delegation);
  • Two working bench in Maia;
  • One working bench in Macau (under evaluation);
    Two working bench in Caen;
  • Dedicated working bench for each IP area according with T&C delegation activity;
  • Two Thermal Stream Machines for temperature corners test (at TagusPark delegation);
  • Three working bench dedicated for PCB assembly and reword during chip debug;
  • Prototyping PCB automatic machine;
    High-tech H/W racks